die bonding

基本解釋

Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工藝引起的器件-封裝熱失配會對MEMS器件的可靠性和性能產(chǎn)生顯著影響。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半導體封裝粘結工藝養(yǎng)護過程要求爐內(nèi)溫度均勻分布，現(xiàn)有養(yǎng)護爐不能滿足這一要求。
The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED熱阻系統(tǒng)的構成，對采用銀漿和環(huán)氧膠作為芯片鍵合材料的功率型LED熱阻進行了對比研究。