heat dissipation

基本解釋

It was designed for maximum heat dissipation.
它的設(shè)計是為了擴大散熱面積。
Samsung has developed a new material for the thin metal tape component that has the optimal properties for effectively maximizing heat dissipation.
而三星公司制造出了一種新的材料，能發(fā)展出具有相當(dāng)好的散熱性能的薄金屬帶。
blog.sina.com.cn
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
這一新型的DDI裝置相比傳統(tǒng)的COF能提高散熱量達20%，因此使得DDI能運行更長時間，并且可靠性更好。
blog.sina.com.cn

The aluminum offers resilience from blunders, improved heat dissipation, and is fully recyclable.
ENGADGET: LaCie embraces USB 3.0 with world's smallest hug, 'world's smallest' HDDs
For example, heat dissipation from the interior of such a chip will be even more difficult to manage than with existing designs.
ECONOMIST: REPORTS
Rather than dwell on the old performance metric of speed, Otellini, in his first Intel Developer Forum speech as CEO, focused on power consumption and heat dissipation of semiconductors.
FORBES: Chief Executive Paul Otellini

散熱
Flip-chip was also studied with this model. It was found that flip-chip may deteriorate the heat dissipation unless bonding area was deliberately arranged.
倒裝芯片的研究發(fā)現(xiàn),倒裝芯片只有合理的設(shè)計鍵合區(qū)域才能改善芯片的散熱性能。
熱耗散
It has weak dispersion, wide bandwidth but weak heat dissipation capability. So the increasing of output power is confined.
螺旋線行波管是目前應(yīng)用最為普遍的行波管之一,它的特點是色散弱,工作頻帶寬,但熱耗散能力差,使得輸出功率的提高受到限制。
計算機科學(xué)技術(shù)
散熱
The power rating and the heat dissipation increases dramatically as the density of the electronic circuit on computer's processor increasing.
計算機芯片的集成度倍增,使得芯片功率和散熱量增加。
機械工程
熱消散
熱傳
散熱

熱耗散
Temperature is the most important parameter of studying heat dissipation.
溫度是研究熱耗散的最重要的參量。
熱消散
熱發(fā)散