microelectronic packaging

基本解釋

It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人矚目的是微電子組裝技術(shù)正在成為現(xiàn)代雷達(dá)及其他電子設(shè)備中最重要的關(guān)鍵技術(shù)之一。
With the development of microelectronic packaging technologies, anisotropic conductive adhesives(ACA)are widely used as one kind of the green materials in the electronic interconnection.
隨著微電子封裝技術(shù)的發(fā)展，各向異性導(dǎo)電膠作為一種綠色的連接材料，廣泛應(yīng)用于電子產(chǎn)品中。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就應(yīng)力—應(yīng)變場有限元數(shù)值模擬在微電子組裝焊點(diǎn)可靠性研究中的應(yīng)用進(jìn)行了綜述。