flip-chip technology

基本解釋

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基板上的倒裝芯片一般採(cǎi)用底部填充技術(shù)以提高其封裝的可靠性。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
論述了如CSP、BGA 及倒裝芯片等先進(jìn)封裝技術(shù)在微電子工業(yè)中所發(fā)揮的重要作用。
The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.
倒裝技術(shù)是發(fā)展的關(guān)鍵技術(shù)，它包括再分佈技術(shù)、凸點(diǎn)底層金屬（UBM）技術(shù)、凸點(diǎn)制備技術(shù)、倒釦銲接技術(shù)和底部填充技術(shù)等。